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1. ANSYS high-frequency current temperature rise simulation steps
The core steps of Ansys high-frequency current temperature rise simulation are: establishing an electromagnetic thermal bidirectional coupling field, using electromagnetic loss calculation as the heat source, and then solving the transient or steady-state temperature field. 1. Preprocessing and geometric modeling use SpaceClaim or DesignModeler to create 3D geometric models of conductors, insulation layers, air domains, etc. Special attention should be paid to local grid refinement of expected current intensive areas (such as sharp corners and contact points).
2. Material property definition. Electromagnetic analysis requires defining the materials conductivity (σ) and relative magnetic permeability (μ ᵣ). Thermal analysis requires the definition of thermal conductivity (k), specific heat capacity (Cp), and density (ρ). Material properties can be set as a function of temperature
3. Electromagnetic field simulation (Maxwell or Mechanical EMAG) 3.1 Excitation and boundary conditions Apply current excitation (Current) or voltage excitation (Voltage) on the conductor, with the frequency set to the actual operating high frequency (such as 100kHz). Apply a Master/Slave or Radiation boundary to the surface outside the air domain to simulate an open field. Use a detailed tetrahedral mesh in the eddy current region (conductor and adjacent areas) and set at least two layers of boundary layer mesh (Inflation Layer) to accurately capture the Skin Effect. Choose Eddy Current as the solution type and run the calculation to obtain the distribution cloud map of Ohmic Loss. This loss density (unit: W/m ³) will be used as a heat source for thermal analysis
4. Steady State Thermal/Transient Thermal 4. Heat source and boundary conditions will be coupled through field coupling or directly imported, and the loss density distribution obtained from electromagnetic calculations will be projected onto the geometric model of thermal analysis as a volumetric heat source (Heat Generation). Set the convective heat transfer coefficient (Convection) and ambient temperature, or apply boundary conditions such as heat flow rate (Heat Flow) and radiation (Radiation)
4.2 Solution settings Choose Steady State to obtain the final equilibrium temperature according to the requirements, or choose Transient Thermal to simulate the temperature rise process, and set the total time and time step
4.3 After solving and post-processing calculations, the temperature distribution cloud map, heat flux density, and temperature rise curve at specific points (Transient analysis) can be viewed
5. Key considerations: The thermal properties parameters of materials (especially electrical conductivity and thermal conductivity) will change dramatically with temperature, and it is recommended to use electromagnetic and thermal methods.
Nonlinear material property options are enabled in the analysis, and bidirectional coupling iterations are performed to obtain accurate results. For complex heat dissipation such as forced air cooling or liquid cooling, Fluent needs to be used for fluid thermal coupling (CFD) simulation.2. Introduction to MeltFlipper Channel Flip Technology in Scientific Injection Molding
MeltFlipper Channel Flip Technology (Branching Runner Thermal and Flow Balancing) is a patented technology of Beaumont Corporation in the United States, aimed at solvi